multilayer ceramic chip capacitors 1 of 3 creation date : december 01, 2017 (gmt) C3216X7R1H475M160AE tdk item description c3216x7r1h475mt***s applications commercial grade please refer to part no. cga5l3x7r1h475m160ae for automotive use. feature soft soft termination series c3216 [eia 1206] status production size length(l) 3.20mm +0.40,-0.20mm width(w) 1.60mm +0.30,-0.20mm thickness(t) 1.60mm +0.30,-0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 1.00mm min. recommended land pattern (pa) 2.10mm to 2.50mm(flow soldering) 2.00mm to 2.40mm(re?ow soldering) recommended land pattern (pb) 1.10mm to 1.30mm(flow soldering) 1.00mm to 1.20mm(re?ow soldering) recommended land pattern (pc) 1.00mm to 1.30mm(flow soldering) 1.10mm to 1.60mm(re?ow soldering) electrical characteristics capacitance 4.7f 20% rated voltage 50vdc temperature characteristic x7r(15%) dissipation factor (max.) 5% insulation resistance (min.) 106m other soldering method wave (flow) re?ow aec-q200 no packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : december 01, 2017 (gmt) C3216X7R1H475M160AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance C3216X7R1H475M160AE esr C3216X7R1H475M160AE capacitance C3216X7R1H475M160AE dc bias characteristic C3216X7R1H475M160AE temperature characteristic C3216X7R1H475M160AE(no bias) C3216X7R1H475M160AE(dc bias = 25v) ripple temperature rising C3216X7R1H475M160AE(100khz) C3216X7R1H475M160AE(500khz) C3216X7R1H475M160AE(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : december 01, 2017 (gmt) C3216X7R1H475M160AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
|
